Hmc-electronics 41145 Loctite 411 Prism Instant Adhesive, Toughene User Manual download pdf

Technical Data Sheet

LOCTITE

411™

September-2009

PRODUCT DESCRIPTION

LOCTITE

411™ provides the following product

characteristics:

Technology Cyanoacrylate

Chemical Type Ethyl cyanoacrylate

Appearance (uncured) Water white to slightly cloudy gel

LMS

Components One part - requires no mixing

Viscosity High

Cure Humidity

Application Bonding

Key Substrates Rubbers, Plastics and Metals

LOCTITE

411™ is a general purpose gap filling adhesive

suitable for bonding rubber, plastic and metals. LOCTITE

411™ exhibits excellent peel strength and added heat

resistance.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C 1.05

Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):

Spindle TC, speed 20 rpm, Helipath 4,000 to 8,000

LMS

Flash Point - See MSDS

TYPICAL CURING PERFORMANCE

Under normal conditions, the atmospheric moisture initiates the

curing process. Although full functional strength is developed

in a relatively short time, curing continues for at least 24 hours

before full chemical/solvent resistance is developed.

Cure Speed vs. Substrate

The rate of cure will depend on the substrate used. The table

below shows the fixture time achieved on different materials

at 22 °C / 50 % relative humidity. This is defined as the time to

develop a shear strength of 0.1 N/mm².

Fixture Time, seconds:

Steel (degreased) 20 to 50

Aluminum 10 to 30

Neoprene <5

Rubber, nitrile <5

ABS 15 to 40

PVC 20 to 50

Polycarbonate 30 to 70

Phenolic 10 to 40

Cure Speed vs. Bond Gap

The rate of cure will depend on the bondline gap. Thin bond

lines result in high cure speeds, increasing the bond gap will

decrease the rate of cure.

Cure Speed vs. Activator

Where cure speed is unacceptably long due to large gaps,

applying activator to the surface will improve cure speed.

However, this can reduce ultimate strength of the bond and

therefore testing is recommended to confirm effect.

TYPICAL PROPERTIES OF CURED MATERIAL

Cured for 24 hours @ 22 °C

Physical Properties:

Coefficient of Thermal Expansion,

ISO 11359-2, K

-1

80×10

-6

Coefficient of Thermal Conductivity, ISO 8302,

W/(m·K)

0.1

Glass Transition Temperature, ASTM E 228, °C 120

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

0.05-kHz 2.3 / <0.02

1-kHz 2.3 / <0.02

1,000-kHz 2.3 / <0.02

Volume Resistivity, IEC 60093, Ω·cm 10×10

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Cured for 30 seconds @ 22 °C

Tensile Strength, ISO 6922:

Buna-N N/mm² ≥7.0

LMS

(psi) (≥1,015)

Cured for 24 hours @ 22 °C

Lap Shear Strength, ISO 4587:

Steel (grit blasted) N/mm² 18 to 26

(psi) (2,610 to 3,770)

Aluminum (etched) N/mm² 11 to 19

(psi) (1,595 to 2,755)

ABS N/mm² >6

(psi) (>870)

PVC N/mm² >6

(psi) (>870)

Polycarbonate N/mm² >5

(psi) (>725)

Phenolic N/mm² 5 to 15

(psi) (725 to 2,175)

Neoprene N/mm² >10

(psi) (>1,450)

Nitrile N/mm² >10

(psi) (>1,450)

Tensile Strength, ISO 6922:

Steel (grit blasted) N/mm² 12 to 25

(psi) (1,740 to 3,625)

Cured for 24 hours @ 22 °C, followed by 24 hours @ 121 °C, tested

@ 121 °C

Lap Shear Strength, ISO 4587:

Steel (grit blasted) N/mm² ≥8.3

LMS

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2 3

Summary of Contents

Page 1 - September-2009

Technical Data Sheet LOCTITE®411™September-2009 PRODUCT DESCRIPTIONLOCTITE®411™ provides the following productcharacteristics:Technology Cyanoacrylat

Page 2 - (800) 482-4440

TDS LOCTITE®411™, September-2009 (psi) (≥1,203)TYPICAL ENVIRONMENTAL RESISTANCECured for 1 week @ 22 °CLap Shear Strength, ISO 4587:Mild

Page 3

TDS LOCTITE®411™, September-2009NoteThe data contained herein are furnished for information onlyand are believed to be reliable. We cannot assumeres

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