Hmc-electronics 32430 Loctite 324 Speedbonder, High Impact Adhesiv User Manual download pdf

Technical Data Sheet

LOCTITE

324™

February-2005

PRODUCT DESCRIPTION

LOCTITE

324™ provides the following product

characteristics:

Technology Acrylic

Chemical Type Urethane methacrylate ester

Appearance (uncured) Transparent light amber liquid

LMS

Components One component - requires no mixing

Viscosity Medium

Cure Anaerobic with activator

Cure Benefit Room temperature cure

Application Bonding

LOCTITE

324™ is used to bond flat parts together. Especially

suitable for joining dissimilar materials, e.g. ferrite to plated

materials in electric motors, loudspeakers, etc. This product is

specifically formulated for toughness and impact strength.

LOCTITE

324™ cures when confined between close fitting

parts with the aid of an activator.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C 1.06

Flash Point - See MSDS

Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):

Spindle 6, speed 20 rpm 10,000 to 24,000

LMS

TYPICAL CURING PERFORMANCE

Cure Speed vs. Substrate

The rate of cure will depend on the substrate used. The graph

below shows the shear strength developed with time on grit

blasted steel lap shears compared to different materials and

tested according to ISO 4587. (Activator 7075™ applied to

one surface)

% of Full Strength on Steel

Cure Time

100

1min 5min10min 30min 1h 3h 6h 24h 72h

Steel

Aluminum

Cure Speed vs. Bond Gap

The rate of cure will depend on the bondline gap. The following

graph shows the shear strength developed with time on grit

blasted steel lap shears at different controlled gaps and tested

according to ISO 4587. (Activator 7075™ applied to one

surface)

% of Full Strength on Steel

Cure Time

100

1min 5min10min 30min 1h 3h 6h 24h 72h

0.25mm

0.5mm

0.05mm

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion, ASTM D 696, K

-1

80×10

-6

Coefficient of Thermal Conductivity, ASTM C 177,

W/(m·K)

0.1

Specific Heat, kJ/(kg·K) 0.3

Elongation, at break, ISO 37, % 170

Tensile Strength, ISO 37 N/mm² 34

(psi) (4,900)

Tensile Modulus, ASTM D 638 N/mm² 614

(psi) (89,000)

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

100-Hz 5.5 / 0.033

1-kHz 5.2 / 0.031

1-MHz 4.5 / 0.004

Volume Resistivity, IEC 60093, Ω·cm 8×10

Surface Resistivity, IEC 60093, Ω 2×10

Dielectric Breakdown Strength, IEC 60243-1, kV/mm 73

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

After 24 hours @ 22 °C, Activator 7075™ on 1 side

Lap Shear Strength, ISO 4587:

Steel (grit blasted):

0 gap N/mm² 17 to 21

(psi) (2,500 to 3,000)

0.5 mm gap N/mm² 21 to 25

(psi) (3,000 to 3,600)

"T" Peel Strength, ISO 11339:

Steel (grit blasted) N/mm 2.2

(lb/in) (13)

After 24 hours @ 22 °C, Activator 7075™ on 2 sides

Lap Shear Strength, ISO 4587:

Steel (grit blasted):

0.5 mm gap N/mm² ≥14

LMS

(psi) (≥2,030)

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2 3

Summary of Contents

Page 1 - February-2005

Technical Data Sheet LOCTITE®324™February-2005 PRODUCT DESCRIPTIONLOCTITE®324™ provides the following productcharacteristics:Technology AcrylicChemic

Page 2 - (800) 482-4440

TDS LOCTITE®324™, February-2005TYPICAL ENVIRONMENTAL RESISTANCECured for 1 week @ 22 °C, Activator 7075™ on 1 sideLap Shear Strength, ISO 4587:Steel

Page 3

TDS LOCTITE®324™, February-2005Conversions(°C x 1.8) + 32 = °FkV/mm x 25.4 = V/milmm / 25.4 = inchesN x 0.225 = lbN/mm x 5.71 = lb/inN/mm² x 145 = ps

Comments to this Manuals

No comments

Hmc-electronics 32430 Loctite 324 Speedbonder, High Impact Adhesiv User Manual

Browse online or download User Manual for Tools Hmc-electronics 32430 Loctite 324 Speedbonder, High Impact Adhesiv. HMC Electronics 32430 Loctite 324 Speedbonder, High Impact Adhesive User Manual

Summary of Contents

Comments to this Manuals

Related products and manuals for Tools Hmc-electronics 32430 Loctite 324 Speedbonder, High Impact Adhesiv