Hmc-electronics 40640 Loctite 406 Prism Instant Adhesive, Surface User Manual download pdf

Technical Data Sheet

LOCTITE

406™

November-2010

PRODUCT DESCRIPTION

LOCTITE

406™ provides the following product

characteristics:

Technology Cyanoacrylate

Chemical Type Ethyl cyanoacrylate

Appearance (uncured) Transparent, colorless to straw

colored liquid

LMS

Components One part - requires no mixing

Viscosity Low

Cure Humidity

Application Bonding

Key Substrates Plastics and Rubbers

LOCTITE

406™ is designed for bonding of plastics and

elastomeric materials where very fast fixturing is required.

Commercial Item Description A-A-3097:

LOCTITE

406™ has been qualified to Commercial Item

Description A-A-3097. Note: This is a regional approval.

Please contact your local Technical Service Center for more

information and clarification.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C 1.05

Viscosity, Cone & Plate, mPa·s (cP):

Temperature: 25 °C, Shear Rate: 3,000 s

-1

12 to 22

LMS

Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):

Spindle 1, speed 30 rpm 15 to 25

Flash Point - See MSDS

TYPICAL CURING PERFORMANCE

Under normal conditions, the atmospheric moisture initiates the

curing process. Although full functional strength is developed

in a relatively short time, curing continues for at least 24 hours

before full chemical/solvent resistance is developed.

Cure Speed vs. Substrate

The rate of cure will depend on the substrate used. The table

below shows the fixture time achieved on different materials

at 22 °C / 50 % relative humidity. This is defined as the time to

develop a shear strength of 0.1 N/mm².

Fixture Time, seconds:

Steel (degreased) 10 to 20

Aluminum (etched) 2 to 10

Zinc dichromate 30 to 90

Neoprene <5

Rubber, nitrile <5

ABS 2 to 10

PVC 2 to 10

Polycarbonate 15 to 50

Phenolic 5 to 15

Cure Speed vs. Bond Gap

The rate of cure will depend on the bondline gap. Thin bond

lines result in high cure speeds, increasing the bond gap will

decrease the rate of cure.

Cure Speed vs. Humidity

The rate of cure will depend on the ambient relative humidity.

The following graph shows the tensile strength developed with

time on Buna N rubber at different levels of humidity.

% Full Cured Strength @ 22 °C

Cure Time, seconds

100

0 10 20 30 40 50 60

60% RH

40% RH

20% RH

Cure Speed vs. Activator

Where cure speed is unacceptably long due to large gaps,

applying activator to the surface will improve cure speed.

However, this can reduce ultimate strength of the bond and

therefore testing is recommended to confirm effect.

TYPICAL PROPERTIES OF CURED MATERIAL

After 24 hours @ 22 °C

Physical Properties:

Coefficient of Thermal Expansion,

ISO 11359-2, K

-1

80×10

-6

Coefficient of Thermal Conductivity, ISO 8302,

W/(m·K)

0.1

Glass Transition Temperature, ASTM E 228, °C 120

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

0.1-kHz 2.65 / <0.02

1-kHz 2.75 / <0.02

10-kHz 2.75 / <0.02

Volume Resistivity, IEC 60093, Ω·cm 10×10

Surface Resistivity, IEC 60093, Ω 10×10

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

After 24 hours @ 22 °C

Lap Shear Strength, ISO 4587:

Steel (grit blasted) N/mm² 18 to 26

(psi) (2,610 to 3,770)

Aluminum (etched) N/mm² 11 to 19

(psi) (1,595 to 2,755)

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2 3

Summary of Contents

Page 1 - November-2010

Technical Data Sheet LOCTITE®406™ November-2010 PRODUCT DESCRIPTIONLOCTITE®406™ provides the following productcharacteristics:Technology Cyanoacrylat

Page 2 - (800) 482-4440

TDS LOCTITE®406™, November-2010Zinc dichromate N/mm² 6 to 14 (psi) (870 to 2,030)ABS N/mm² 4 to 6 (psi) (5

Page 3

TDS LOCTITE®406™, November-2010NoteThe data contained herein are furnished for information onlyand are believed to be reliable. We cannot assumeres

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Hmc-electronics 40640 Loctite 406 Prism Instant Adhesive, Surface User Manual

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