Hmc-electronics R562 Kester Solder Paste User Manual download pdf

R562

Water-Soluble Solder Paste

Product Description

Kester R562 is an organic acid, water-soluble

solder paste specifically designed for resistance to

environmental extremes. Water-soluble pastes

tend to dry out in low relative humidity and slump

at high relative humidity. R562 will maintain its

print characteristics, tack and activity even after

exposure to environmental extremes.

• Reduces BGA voiding to <3%

• Bright, shiny joints

• 12 hour stencil life

• Print speeds up to 6 in/sec

• Compatible with enclosed print head systems

• Capable of multiple reflow profiles before a

cleaning operation is required

• Consistent printing over a range of temper-

atures and humidity

• Excellent solderability to a wide variety of

metallizations, including Palladium

• Residues easily removed with hot DI water,

even up to 96 hours after processing

• Classified as ORH0 per J-STD-004

Standard Applications

90% Metal - Stencil Printing

90% Metal - Enclosed Head Printing

Physical Properties

(Data given for Sn63Pb37, 90% metal, -325+500 mesh)

Viscosity (typical): 1750 poise

Malcom viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 48 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: High

Tested to J-STD-004, IPC-TM-650, Method 2.3.32

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank R562

Day 1

3.2 ×10

Ω 3.4 × 10

Ω

Day 4

1.2 ×10

Ω 1.9 × 10

Ω

Day 7

1.3 ×10

Ω 4.1 × 10

Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2

Summary of Contents

Page 1 - Water-Soluble Solder Paste

R562R562Water-Soluble Solder PasteWater-Soluble Solder PasteProduct DescriptionKester R562 is an organic acid, water-solublesolder paste specifically

Page 2 - Application Notes

Application NotesAvailability:R562 is commonly available in the Sn63Pb37 and Sn62Pb36Ag02 alloys. Type 3 powder mesh isrecommended, but different pow

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