Hmc-electronics R276 Kester Lead-Free Paste User Manual download pdf

R276

Dispensable No-Clean Solderpaste

for Lead-free Alloys

Product Description

Kester R276 is a lead-free, no-clean solder paste

specifically designed for optimal characteristics in

all types of dispensing applications. R276 is

packaged void-free to insure consistent dispensing

in high speed automated processes. The flow

characteristics of R276 provide for excellent

dispensing characteristics with a wide range of

needle diameters.

• Excellent dispensing characteristics using 22

gage needles and Type 3 powder

• Manufactured and packaged void-free to insure

the most consistent dispensibility available

• Capable of several thousands of dots per hour

in high speed automated dispense equipment

• High activity on all substrates, including OSPs

• Stable tack over 8+ hours

• Available with leaded alloys

• Compatible with Kester Easy Profile

256

stenciling solderpaste

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

Standard Application

86% Metal -- Dispensing

RoHS Compliance

This product meets the requirements of the RoHS

(Restriction of Hazardous Substances) Directive,

2002/95/EC Article 4 for the stated banned

substances.

Physical Properties

(Data given for Sn96.5Ag3.0Cu0.5 86% metal, -325+500 mesh)

Viscosity (typical): 650 poise

Malcom Viscometer @ 10rpm and 25°C

Initial Tackiness (typical): 30 grams

Tested to J-STD-005, IPC-TM-650, Method 2.4.44

Slump Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.35

Solder Ball Test: Preferred

Tested to J-STD-005, IPC-TM-650, Method 2.4.43

Wetting Test: Pass

Tested to J-STD-005, IPC-TM-650, Method 2.4.45

Reliability Properties

Copper Mirror Corrosion: Low

Tested to J-STD-004, IPC-TM-650, Method 2.3.3

Corrosion Test: Low

Tested to J-STD-004, IPC-TM-650, Method 2.6.15

Silver Chromate: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.33

Chloride and Bromides: None Detected

Tested to J-STD-004, IPC-TM-650, Method 2.3.35

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1

SIR, IPC (typical): Pass

Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3

Blank R276

Day 1

1.0 ×10

Ω 9.8 × 10

Ω

Day 4

1.3 ×10

Ω 1.6 × 10

Ω

Day 7

1.3 ×10

Ω 1.1 × 10

Ω

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440

1 2

Summary of Contents

Page 1 - Reliability Properties

R276R276Dispensable No-Clean SolderpasteDispensable No-Clean Solderpastefor Lead-free Alloysfor Lead-free AlloysProduct DescriptionKester R276 is a le

Page 2 - Application Notes

Application NotesAvailability:R276 is available in the Sn96.5 Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is recommended,but Type 4 is avai

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Hmc-electronics R276 Kester Lead-Free Paste User Manual

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